Key Specs
| Spec | Value | Condition | Source |
|---|---|---|---|
| Channel Type | 3-Phase | Digi-Key | |
| Current Peak Output Source Sink | - | Digi-Key | |
| Digikey Programmable | Not Verified | Digi-Key | |
| Driven Configuration | Half-Bridge | Digi-Key | |
| Gate Type | IGBT, MOSFET (N-Channel, P-Channel) | Digi-Key | |
| High Side Voltage Max Bootstrap | 620 V | Digi-Key | |
| Input Type | Non-Inverting | Digi-Key | |
| Logic Voltage Vil Vih | 1.1V, 1.7V | Digi-Key | |
| Mounting Type | Surface Mount | Digi-Key | |
| Number Of Drivers | 6 | Digi-Key | |
| Operating Temperature Range | -40°C ~ 125°C (TJ) | Digi-Key | |
| Package Case | 28-SOIC (0.295”, 7.50mm Width) | Digi-Key | |
| Rise Fall Time (Typ) | 60ns, 26ns | Digi-Key | |
| Supplier Device Package | PG-DSO-28 | Digi-Key | |
| Voltage Supply | 10V ~ 17.5V | Digi-Key |
When To Use
Use the 6EDL04N06PTXUMA1 in 3-phase motor drive applications requiring integrated half-bridge drivers with both source and sink current capability, supporting IGBT and MOSFET gate types. Its operating temperature range of -40°C to 125°C (TJ) and logic input thresholds (VIL = 1.1 V, VIH = 1.7 V) make it suitable for industrial environments where robust and reliable gate driving is needed. Avoid using this device in single-phase or non-half-bridge configurations, or where gate drive voltage exceeds 17.5 V, as it is optimized specifically for half-bridge topologies with a supply voltage up to 17.5 V. For applications requiring higher voltage or different gate drive configurations, consider alternative driver ICs tailored to those needs.
When Not To Use
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Output current > 15A continuous: The current rating implied by the package and thermal limits disqualifies this device for very high current applications. Use a high-current synchronous buck with external FETs instead, as that category handles higher current with better thermal dissipation and efficiency.
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Switching frequency > 500 kHz for compact magnetics: The rise/fall times of 60 ns and 26 ns, combined with the half-bridge design, limit the switching speed achievable without excessive switching losses. A high-frequency buck controller should be used where switching above 500 kHz is required.
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Battery-powered system with μA standby current: The internal driver logic does not specify ultra-low quiescent current and may draw mA-level bias during idle. For systems where quiescent current dominates power budget, use a low-IQ PFM buck instead.
Application Notes
The switching node connected to the half-bridge output pin must have the smallest possible loop area to reduce EMI and switching losses. Pay particular attention to the layout around this node to maintain signal integrity. The logic input pins are noise-sensitive and should be routed away from high dv/dt switching nodes to prevent false triggering. Given the device’s operating temperature range up to 125°C (TJ), a heatsink is generally not required under typical operating conditions when proper PCB thermal management is implemented; however, thermal considerations should be evaluated based on the specific application load and ambient conditions.
Gotchas
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Incorrect supply voltage range
Mistake: Applying a supply voltage outside the specified 10 V to 17.5 V range.
Failure: The device may malfunction or sustain permanent damage due to overvoltage or undervoltage conditions.
Fix: Always ensure the supply voltage stays within 10 V to 17.5 V to guarantee proper operation and device longevity. -
Neglecting proper PCB layout for switching nodes
Mistake: Routing the switching node with a large loop area or placing sensitive input pins close to noisy switching nodes.
Failure: Increased electromagnetic interference (EMI) and unstable input signals leading to erratic driver behavior or false triggering.
Fix: Minimize the loop area around the switching node; keep noise-sensitive input pins physically separated from high dv/dt nodes and use appropriate PCB layout techniques.