Key Specs

SpecValueConditionSource
Digikey ProgrammableNot VerifiedDigi-Key
Driven ConfigurationHalf-BridgeDigi-Key
Channel TypeIndependentDigi-Key
Number Of Drivers2Digi-Key
Gate TypeIGBT, SiC MOSFETDigi-Key
Voltage Supply20VDigi-Key
Logic Voltage Vil Vih-, 1.65VDigi-Key
Current Peak Output Source Sink4A, 8ADigi-Key
Input TypeNon-InvertingDigi-Key
High Side Voltage Max Bootstrap650 VDigi-Key
Rise Fall Time (Typ)6.5ns, 4.5nsDigi-Key
Operating Temperature Range-40°C ~ 125°C (TA)Digi-Key
Mounting TypeSurface MountDigi-Key
Package Case16-SOIC (0.154”, 3.90mm Width)Digi-Key
Supplier Device PackagePG-DSO-16-11Digi-Key

When To Use

Use the 2EDF9275FXUMA1 in applications requiring a half-bridge gate driver with independent dual channels supporting IGBT or SiC MOSFET gate types, operating up to a maximum high-side bootstrap voltage of 650 V. Its fast rise and fall times (6.5 ns and 4.5 ns typical) and peak output currents of 4 A sourcing and 8 A sinking make it suitable for high-frequency switching applications up to 2 MHz, such as motor drives and power inverters.

Avoid using this device in systems demanding supply voltages outside the 8.5 V to 14 V input range or where logic input voltage thresholds below 1.65 V are required, as the input threshold is not specified below this level. For applications requiring integrated isolation or higher voltage ratings beyond 650 V bootstrap voltage, consider alternative drivers with isolated gate drive or higher voltage tolerance.


When Not To Use

  1. Output currents > 8A continuous: The 2EDF9275FXUMA1 max peak output source of 4A and sink of 8A limits sustained high current. Use a high-current synchronous buck with external FETs to handle heavy loads without overheating or gate drive distortion.

  2. Battery-powered devices with ultra-low sleep current: The typical quiescent current around 1.4 mA (input) is too high for coin cell or μA-scale standby. Use a low-IQ PFM buck to maximize battery life in always-on low-power systems.

  3. Small voltage differential, noise-sensitive linear regulation (<1V dropout): The half-bridge driver architecture and switching nature are unsuitable where low noise and close-in regulation are required. Use an LDO regulator for clean, low dropout voltage rails.


Application Notes

Gotchas

  1. [Bootstrap capacitor undervaluing]: Designers often choose bootstrap capacitors too small, assuming just enough charge for one switching cycle. At 2 MHz switching and 4A peak output current, insufficient bootstrap charge leads to gate voltage droop and incomplete MOSFET turn-on, causing elevated conduction losses and thermal stress. Fix: Verify bootstrap capacitor sizing with measured gate voltage waveform under maximum load and switching frequency.

  2. [Noisy PWM input routing]: Routing PWM inputs near the high dv/dt half-bridge node causes false triggering or jitter due to capacitive coupling. Symptoms include erratic output pulses or phase shifts visible on scope. Fix: Use shielded traces or route PWM inputs on separate layers with ground guard traces to reduce noise pickup.

  3. [Ignoring input UVLO hysteresis]: Some applications assume the driver will immediately restart when input supply returns above UVLO threshold. The built-in hysteresis (~0.8 V typical) can cause delayed or missed turn-on at startup, leading to partial switching or shoot-through. Fix: Design power sequencing and ramp-up profiles to exceed UVLO thresholds with margin and verify startup waveforms.

  4. [Output capacitor ESR impact on switching stability]: Using output capacitors with excessively low ESR or large ceramic-only banks can introduce high-frequency resonances with the driver output impedance at 2 MHz, causing ringing or oscillations. Fix: Add a small ESR bulk capacitor or RC snubber on the output stage to damp high-frequency oscillations and stabilize switching waveforms.