Key Specs
| Spec | Value | Condition | Source |
|---|---|---|---|
| Channel Type | Single | Digi-Key | |
| Current Peak Output Source Sink | 6A, 6A | Digi-Key | |
| Digikey Programmable | Not Verified | Digi-Key | |
| Driven Configuration | Low-Side | Digi-Key | |
| Gate Type | IGBT, MOSFET (N-Channel, P-Channel) | Digi-Key | |
| Input Type | Non-Inverting | Digi-Key | |
| Logic Voltage Vil Vih | 0.8V, 2.4V | Digi-Key | |
| Mounting Type | Surface Mount | Digi-Key | |
| Number Of Drivers | 1 | Digi-Key | |
| Operating Temperature Range | -40°C ~ 125°C | Digi-Key | |
| Package Case | 8-SOIC (0.154”, 3.90mm Width) | Digi-Key | |
| Rise Fall Time (Typ) | 20ns, 20ns | Digi-Key | |
| Supplier Device Package | 8-SOIC | Digi-Key | |
| Voltage Supply | 4.5V ~ 18V | Digi-Key |
When To Use
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Low-side gate drive for 12V N-channel MOSFET @ 6A peak: The 6A peak source and sink current capability and 4.5–18V supply range perfectly match typical 12V MOSFET gate drive requirements, ensuring fast switching with 20ns rise/fall times. Using a gate driver with lower peak current would cause slow transitions, increasing switching losses and risking thermal runaway in the MOSFET.
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IGBT gate drive in industrial motor control, 15V supply: The driver’s compatibility with both IGBT and MOSFET gates and its non-inverting input logic with V_IL = 0.8V and V_IH = 2.4V ensures clean, reliable switching under noisy industrial signals. A logic interface without specified input thresholds risks latch-up or unintended conduction in high-noise environments.
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Single-channel synchronous buck converter low-side driver @ 10A transient peaks: The single-driver configuration with 6A peak current supports transient gate charging for typical MOSFETs, maintaining switching performance. Using a multi-phase or synchronous buck controller here would be overkill and add complexity; a low-current driver would lead to shoot-through due to slow gate transitions.
When Not To Use
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Buck converter outputting >10A continuous current: The 6A peak current rating is insufficient for sustained high current MOSFET drive; this risks slow switching and excessive losses. Use a multi-phase buck controller instead, designed for higher current sharing and smoother gate drive.
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Battery-powered sensor requiring ultra-low quiescent current: The device’s quiescent current is not optimized for μA-level sleep modes and will drain small batteries quickly. Use a low-IQ PFM buck regulator for minimal standby consumption.
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High-frequency switching > 500kHz for small inductors: The rise/fall times and switching performance are typical for ≤500kHz operation; above this frequency, switching losses and timing degrade. Use a high-frequency buck controller that supports sub-20ns transitions at elevated switching frequencies.
Application Notes
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Keep the gate drive return path low inductance by placing the driver ground pin (pin 4) close to the MOSFET source return to minimize switching noise and prevent false triggering.
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the input pin and the output pin are sensitive to noise coupling; route gate drive signals away from noisy switching nodes (SW) to avoid erratic switching or unintended turn-on.
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The SW node (external MOSFET drain/source connection) can have high dv/dt; provide a ground flood or guard ring around the driver to shield sensitive input and output traces.
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Use a local decoupling capacitor (≥0.1µF ceramic) between V_DD (pin 8) and ground (pin 4) placed as close as possible to the driver pins to maintain stable supply under fast switching current pulses.
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Avoid long gate drive traces to minimize parasitic inductance and ringing, which may cause voltage overshoot damaging the MOSFET or driver output stage.
Pin numbers are package-specific. Verify against the datasheet pinout diagram before routing.
Gotchas
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[Underestimating thermal derating at high ambient]: The driver is rated to 125°C max operating temperature, but peak current capability drops with junction temperature (not explicit in main specs). Running close to 125°C with 6A pulses can cause thermal runaway unnoticed in initial tests.
Fix: Verify junction temperature under worst-case load with thermal imaging and derate peak current by 20% at >100°C ambient. -
[Floating input during startup]: The input (pin 2) has non-inverting logic with defined VIH and VIL, but leaving it unconnected or weakly driven can cause output glitches or unintended MOSFET gate charging, leading to shoot-through or EMI bursts.
Fix: Tie input to a known logic level through a defined resistor or use a dedicated microcontroller I/O pin with a pull-down/up. -
[Ignoring gate charge variations in large MOSFETs]: The driver’s 6A peak current is instantaneous and cannot sustain continuous high gate charge currents for large MOSFETs with high total gate charge, resulting in slow transition times and elevated switching losses.
Fix: Confirm gate charge and switching frequency; if sustained high gate drive current is required, consider paralleling drivers or reducing switching frequency. -
[No guard traces near input and output pins]: Routing sensitive input and output signals close to noisy switching nodes (SW) without guard traces or ground shielding can induce false switching pulses or oscillations during transient events.
Fix: Implement ground guard traces or split ground planes to isolate driver input/output from high dv/dt nodes.