MCP1407T-E/SN vs 2EDN7524FXTMA1: Low-Side Gate Driver IC Comparison

Quick verdict

For single-channel low-side gate drive applications requiring high peak current and simple non-inverting logic, the MCP1407T-E/SN offers a stronger 6A peak drive and broader MOSFET/IGBT compatibility, making it preferable for high-current discrete MOSFET or IGBT switching. For dual-channel applications demanding faster switching edges and higher junction temperature tolerance, the 2EDN7524FXTMA1 is better suited thanks to its 5.3ns rise and 4.5ns fall times and 150°C TJ rating, despite its slightly lower 5A peak current per channel.

Spec comparison table

SpecMCP1407T-E/SN2EDN7524FXTMA1Notes
Channel TypeSingleIndependent (2 channels)Dual channels in 2EDN7524FXTMA1 enable driving two devices separately; MCP1407T is single channel.
Peak Output Current (Source)6A5AHigher peak current in MCP1407T-E/SN allows driving larger gate charge devices faster.
Peak Output Current (Sink)6A5ASame as above; better sinking current helps faster turn-off in MCP1407T-E/SN.
ProgrammableNot VerifiedNot VerifiedNo known programmable features in either.
Driven ConfigurationLow-SideLow-SideBoth specialized for low-side drive; no high-side capability.
Supported Gate TypesIGBT, MOSFET (N-, P-Channel)MOSFET (N-Channel)MCP1407T-E/SN supports IGBTs and P-channel MOSFETs, offering wider device compatibility.
Input TypeNon-InvertingNon-InvertingBoth respond to logic high inputs with gate drive output high.
Logic Voltage VIH / VIL2.4V / 0.8VNot SpecifiedMCP1407T-E/SN logic thresholds defined; 2EDN7524FXTMA1 datasheet omits.
Mounting TypeSurface MountSurface MountBoth suitable for SMD PCB assembly.
Number of Drivers122EDN7524FXTMA1 supports driving two MOSFETs independently; MCP1407T-E/SN is single channel.
Operating Temperature Range-40°C to 125°C-40°C to 150°C (TJ)2EDN7524FXTMA1 is rated for 25°C higher max junction temperature, useful in hot environments.
Package / Case8-SOIC (3.90mm width)8-SOIC (PG-DSO-8-60, 3.90mm width)Both in 8-pin SOIC packages with similar footprint size, but package details differ (PG-DSO vs standard SOIC).
Typical Rise Time20ns5.3ns2EDN7524FXTMA1 switches about 4x faster, reducing switching losses on gate drive transitions.
Typical Fall Time20ns4.5nsSame as above; faster fall time reduces turn-off losses and EMI.
Voltage Supply Range4.5V to 18V4.5V to 20V2EDN7524FXTMA1 supports a slightly wider supply voltage range.

Design trade-offs

The MCP1407T-E/SN’s 6A peak source and sink current capability afford it a distinct advantage when driving high gate charge MOSFETs or IGBTs, especially in applications where rapid charging or discharging of the gate is critical to minimize switching losses and improve efficiency. The ability to drive P-channel devices and IGBTs directly broadens its applicability in mixed device topologies. However, its rise and fall times of 20ns are significantly slower compared to the 2EDN7524FXTMA1, which features 5.3ns rise and 4.5ns fall times, implying the Infineon device can switch gate voltages roughly four times faster, benefiting hard switching and high-frequency applications where switching losses and EMI are concerns.

Thermally, the 2EDN7524FXTMA1’s higher junction temperature rating of 150°C (vs 125°C for the MCP1407T-E/SN) offers more headroom in high ambient temperature or high power-density environments, potentially reducing derating requirements and increasing reliability margins. The trade-off is its slightly lower peak current (5A vs 6A), which may limit its ability to rapidly drive very large gate charge devices or those with slower switching requirements.

The dual-channel nature of the 2EDN7524FXTMA1 allows driving two independent MOSFET gates from a single IC, which can reduce component count and board area in half-bridge or synchronous rectifier applications. Conversely, the MCP1407T-E/SN is single channel only, so applications needing multiple channels will require multiple ICs.

From a layout perspective, the faster switching speed of the 2EDN7524FXTMA1 demands careful PCB design to manage voltage overshoot, ringing, and EMI, including short gate drive loops and adequate decoupling. The MCP1407T-E/SN’s slower edge rates provide a more forgiving layout margin but potentially at the expense of increased switching losses.

Package-wise, both come in 8-pin surface mount SOIC packages with the same nominal width (3.9mm), but the Infineon’s PG-DSO-8-60 package may have different thermal characteristics and pinout details. This can impact thermal dissipation and footprint compatibility.

Cost at volume is not provided here, but Microchip’s MCP1407T-E/SN is typically positioned as a cost-effective single driver, while Infineon parts with dual drivers and faster switching tend to command a premium. The choice between them should weigh cost against the need for speed, thermal tolerance, and channel count.

Use-case fit

Choose MCP1407T-E/SN when…

Choose 2EDN7524FXTMA1 when…

Drop-in compatibility

Both devices are offered in 8-pin SOIC packages with the same nominal width (3.90mm), but the MCP1407T-E/SN is in a standard 8-SOIC package, while the 2EDN7524FXTMA1 uses Infineon’s PG-DSO-8-60 package. Pinouts are not provided here, so direct pin-to-pin compatibility cannot be confirmed. Furthermore, the 2EDN7524FXTMA1 has two independent driver channels, implying a different pin configuration compared to the single-channel MCP1407T-E/SN.

Therefore, they are not guaranteed to be footprint or pin-compatible without detailed datasheet cross-checking and possible PCB modifications. Voltage supply and logic thresholds differ, so substituting one for the other without verifying drive voltage levels and logic input requirements is not advisable.

Alternatives to consider