Component Comparison: LM2596S-5.0/NOPB vs CLB40I1200PZ-TRL

Quick verdict

For low-to-mid power DC-DC step-down regulation up to 3A and 40V input, the LM2596S-5.0/NOPB is a practical, integrated buck converter solution with minimal external components and straightforward implementation. Conversely, the CLB40I1200PZ-TRL is a high-power SCR thyristor discrete device designed for switching large currents (up to 40A) at high voltages (up to 1300V), making it suitable only for very different use cases such as industrial power control or AC phase control, not for DC-DC regulation.


Spec comparison table

SpecLM2596S-5.0/NOPBCLB40I1200PZ-TRLNotes
FunctionStep-Down Buck Regulator ICSCR Thyristor DiscreteDifferent categories: integrated regulator vs discrete thyristor; not interchangeable.
Input Voltage Max40 V1300 VCLB40I1200PZ-TRL supports much higher voltage, suitable for high-voltage circuits.
Input Voltage Min4.5 V18.3 VLM2596S supports low-voltage inputs, better for low-voltage DC-DC applications.
Mounting TypeSurface MountSurface MountBoth are surface mount but different package types.
Number of Outputs11Both single output devices but fundamentally different functions.
Operating Temperature Range-40°C to 125°C (TJ)-40°C to 125°C (typ)Comparable operating temperature ranges.
Output ConfigurationPositiveN/ANot applicable for SCR discrete device.
Output Current Max3 A40 ACLB40I1200PZ-TRL supports much higher current, but for different application.
Output TypeFixed 5VN/ALM2596S outputs fixed regulated voltage; SCR is a switch, no regulated output voltage.
Output Voltage Max/Min5 V fixedN/ALM2596S fixed 5V output; SCR not for voltage regulation.
Package CaseTO-263-6, D2PAK (5 Leads + Tab)TO-263D2Different package variants; footprint likely different.
Supplier Device PackageTO-263 (DDPAK-5)TO-263D2Not pin-compatible; different package pinouts and functions.
Switching Frequency Typ150 kHz50 Hz maxLM2596S designed for high-frequency switching; SCR is line-frequency device.
Synchronous RectifierNoN/ALM2596S uses diode rectification; SCR has no synchronous rectifier function.
TopologyBuckThyristor (SCR)Fundamentally different device types and topologies.
Reverse Current TypN/A10 µASCR off-state leakage current; LM2596S not specified here.
Forward Voltage Drop Typ (40A)N/A1.30 VSCR conduction loss relevant at high currents; LM2596S internal losses not directly comparable.
Forward Voltage Drop Typ (80A)N/A1.59 VSame as above; SCR designed for very high currents.
Forward Voltage Drop Typ @125°C (40A)N/A1.26 VSlightly lower voltage drop at elevated temperature for SCR.
Forward Voltage Drop Typ @125°C (80A)N/A1.64 VIncreased conduction losses at high current and temperature.
Forward Current Max3 A40 ASCR supports much higher current.
RMS Forward Current TypN/A63 AHigh RMS current capability for SCR.
Threshold Voltage Max @150°CN/A0.85 VRelevant to SCR gate triggering; no equivalent in LM2596S.
Slope Resistance TypN/A9.9 mΩImportant for conduction losses in SCR; not applicable for LM2596S.
Thermal Resistance Junction-Case TypN/A0.4 K/WSCR package thermal conductivity data; LM2596S datasheet does not specify explicitly.
Thermal Resistance Case-Heatsink TypN/A0.25 K/WSCR thermal management parameter.
Total Power Dissipation Max @25°CN/A310 WHigh power dissipation capability of SCR; LM2596S limited by IC dissipation and package.
Forward Surge Current Typ (50Hz, 10ms)N/A520 ASCR can handle large surge currents briefly; LM2596S cannot.
Gate Trigger Voltage TypN/A1.7 VSCR gate triggering characteristic; no gate trigger in LM2596S.
Gate Trigger Current TypN/A30 mASCR gate current requirement; LM2596S has no external gate control.
Gate Non-Trigger Voltage TypN/A2/3 VSCR gate leakage characteristic.
Gate Non-Trigger Current MinN/A1 mASCR gate leakage current.
Latching Current TypN/A100 mASCR must exceed latching current to remain on.
Holding Current TypN/A70 mASCR must maintain above holding current to stay on.
Turn Off Time TypN/A150 µsSCR turn-off delay; LM2596S switching frequency is much higher.
RMS Current MinN/A35 ASCR minimum RMS current rating.
Virtual Junction Temperature Min-40°C-40°CSimilar minimum operating temperature.
Virtual Junction Temperature Typ125°C150°CSCR device can tolerate higher junction temperature.
Operation Temperature Min-40°C-40°CBoth devices support industrial temperature range.
Operation Temperature Typ125°C125°CTypical max operating temperature.
Storage Temperature Min-40°C-40°CComparable storage temperature ratings.
Storage Temperature Typ150°C150°CComparable storage temperature ratings.
Weight MinN/A1.5 gSCR is a discrete power device with measurable weight.
Mounting Force With Clip MinN/A20 NSCR requires mechanical mounting force for heatsink; LM2596S usually PCB mounted.
Dimension A (min/typ)N/A4.06 / 4.83 mmSCR physical dimensions; LM2596S datasheet does not provide dimensions here.
Dimension B (min/typ)N/A0.51 / 0.99 mmSCR pin dimension details.
Dimension C (min/typ)N/A0.40 / 0.74 mmSCR pin dimension details.
Input Voltage TypN/A80 VSCR typical blocking voltage.
Switching Frequency Max150 kHz50 HzLM2596S designed for high-frequency PWM; SCR is line-frequency device.
Diode Forward Voltage MinN/A1.78 VSCR internal diode characteristic.
Diode Forward Voltage TypN/A3 VSCR internal diode voltage drop.
Diode Forward Current MaxN/A10 ASCR internal diode current rating.
Junction Temperature MinN/A-25°CSCR junction temperature minimum rating.
Junction Temperature TypN/A45°CSCR typical junction temperature.
Junction Temperature MaxN/A150°CMax junction temperature for SCR.
Thermal Impedance MinN/A0.07 K/WSCR thermal impedance minimum.
Thermal Impedance TypN/A2.54 K/WSCR thermal impedance typical.
Thermal Impedance MaxN/A10.92 K/WSCR thermal impedance maximum.
Gate Voltage MinN/A0 VSCR gate driving voltage range.
Gate Current TypN/A10 mASCR gate current typical value.

Design trade-offs