Key Specs
| Spec | Value | Condition | Source |
|---|---|---|---|
| Output Configuration | Half Bridge | Digi-Key | |
| Applications | Synchronous Buck Converters | Digi-Key | |
| Interface | PWM | Digi-Key | |
| Load Type | Inductive | Digi-Key | |
| Technology | Power MOSFET | Digi-Key | |
| RDS On (Typ) | - | Digi-Key | |
| Current Output Channel | 20A | Digi-Key | |
| Current Peak Output | 45A | Digi-Key | |
| Voltage Supply | 4.5V ~ 5.5V | Digi-Key | |
| Voltage Load | 4.5V ~ 24V | Digi-Key | |
| Operating Temperature Range | -40°C ~ 150°C (TJ) | Digi-Key | |
| Features | Bootstrap Circuit | Digi-Key | |
| Fault Protection | Shoot-Through, UVLO | Digi-Key | |
| Mounting Type | Surface Mount | Digi-Key | |
| Package Case | 8-PowerVFDFN | Digi-Key | |
| Supplier Device Package | 8-VSON (3.5x4.5) | Digi-Key |
When To Use
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5.5V input → 7.2V @ 9A synchronous buck: The 20A continuous and 45A peak current ratings fit well with typical 9A loads and transient demands, while the 4.5V–24V input range covers the 5.5V supply with margin. Using a low-current synchronous buck controller would cause shoot-through or thermal runaway under these transient peaks due to insufficient MOSFET ratings.
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12V input → 1.3V @ 20A high-current load: The half-bridge Power MOSFET technology and ultra-low inductance SON package support switching at up to 2MHz, enabling small inductors and stable operation at 20A continuous current. A multi-phase buck controller or discrete external FET solution would be overkill and increase BOM complexity unnecessarily.
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24V input → 4.5V @ 10A with FCCM diode emulation: The built-in diode emulation mode (FCCM) and shoot-through protection allow efficient synchronous rectification on inductive loads, reducing switching noise and losses at moderate frequencies (~500kHz). Using a non-FCCM synchronous buck controller risks excessive body diode conduction and increased EMI during load transients.
When Not To Use
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> 45A peak current transient applications: The 45A peak output current max is a hard limit. For higher transient currents, use a high-current synchronous buck with external FETs to avoid thermal runaway or device destruction.
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Continuous switching frequency > 500kHz: Although the device supports up to 2MHz max, typical recommended switching is 500kHz. For stable, efficient operation above this, use a high-frequency buck controller designed specifically for >500kHz operation.
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Battery-powered, ultra-low sleep current IoT nodes: The quiescent current minimum of 130µA is too high for coin cell or μA-scale standby currents. Use a low-IQ PFM buck controller for these applications to avoid premature battery drain.
Application Notes
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The switching node (SW) is pin 4; minimize the PCB trace length between SW and output inductor to reduce EMI and voltage ringing. Keep this node tightly coupled to the inductor and output capacitor.
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Pin 3 is power ground; ensure low-impedance connection to PCB ground plane with multiple vias to reduce thermal resistance and noise coupling.
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Pin 5 is the input voltage pin; place the recommended 100-nF 16-V X5R ceramic capacitor as close as possible to this pin to stabilize VDD and prevent UVLO faults.
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The diode emulation function on pin 1 requires proper layout to avoid noise injection; route this pin away from switching node traces and sensitive PWM inputs.
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Use a 1–4.7 Ω bootstrap resistor and a 1 µF to 10 µF X5R or better ceramic capacitor on the bootstrap pin to ensure reliable high-side drive; bootstrap capacitor placement within 1–2 mm of the device is critical.
Pin numbers are package-specific. Verify against the datasheet pinout diagram before routing.
Gotchas
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[Bootstrap capacitor undervaluing causing high-side MOSFET dropouts]: Designers may use a bootstrap capacitor smaller than the recommended 1 µF minimum, assuming any ceramic cap will suffice. This results in insufficient gate charge for the high-side MOSFET, causing erratic switching or partial conduction visible as increased switching node voltage ripple and loss of output regulation. Fix by using a 1 µF or larger X5R or better ceramic capacitor placed immediately adjacent to the device bootstrap pin.
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[Excessive via solder wick reduces thermal performance]: Over-soldering vias near the power ground or switching node can wick solder down the via barrel, increasing thermal resistance and causing localized hot spots. This may appear as unexpected junction temperature rises despite normal load conditions. Fix by spacing vias deliberately, using minimum drill sizes (10 mil), and tenting opposite side with solder mask to control solder flow.
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[PWM tristate window misinterpretation causing shoot-through]: Assuming the PWM input logic thresholds are symmetrical or ignoring the tristate deadband window leads to overlapping high and low gate drive signals, causing shoot-through current spikes visible as switching node noise bursts and possible device stress. Fix by verifying PWM input voltage thresholds and ensuring control signals respect the tristate window timing and voltage levels.
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[Ignoring minimum load current leading to output voltage instability]: Operating at output currents below 1 A (minimum output current spec) can cause the diode emulation mode to misbehave, resulting in output voltage oscillations or excessive ripple under light load conditions. Fix by ensuring minimum load or adding a bleed resistor to maintain stable diode emulation operation.