Comparison of Infineon 1EDN7116GXTMA1 vs 2EDL8024GXUMA1 High-Side Gate Drivers

Quick verdict

For high-voltage, single-channel GaN or MOSFET high-side gate driving up to 200 V bootstrap, the 1EDN7116GXTMA1 excels with its fast 3 ns rise/fall times and 2 A peak drive current, making it ideal for high-speed, high-voltage GaN applications. Conversely, the 2EDL8024GXUMA1 is better suited for dual-channel high- and low-side MOSFET drive at moderate voltages (up to 90 V bootstrap), offering stronger drive strength (4 A peak) but slower switching edges (45 ns rise/fall time), fitting applications requiring robust drive current and half-bridge configurations.

Spec comparison table

Spec1EDN7116GXTMA12EDL8024GXUMA1Notes
Channel typeIndependentIndependentBoth offer independent channels; 1EDN7116GXTMA1 has 1 channel, 2EDL8024GXUMA1 has 2
Number of drivers122EDL8024GXUMA1 supports high- and low-side drive in one IC; 1EDN7116GXTMA1 is single channel
Driven configurationHigh-SideHigh-Side, Low-Side2EDL8024GXUMA1 supports half-bridge applications; 1EDN7116GXTMA1 only high-side
Gate typeGaN FET, MOSFET (N-Channel)MOSFET (N-Channel)1EDN7116GXTMA1 explicitly supports GaN, useful for GaN-specific drive
Peak output current (source/sink)2 A / 2 A4 A / 4 A2EDL8024GXUMA1 provides twice the peak drive current, beneficial for large gate charge or fast switching
High-side max bootstrap voltage200 V90 V1EDN7116GXTMA1 supports over twice the bootstrap voltage, enabling higher voltage rails
Input typeNon-InvertingNon-InvertingBoth have non-inverting inputs
Voltage supply range4.2 V ~ 11 V8 V ~ 17 V1EDN7116GXTMA1 supports lower supply voltages, allowing flexibility with lower voltage rails
Rise/fall time (typical)3 ns / 3 ns45 ns / 45 ns1EDN7116GXTMA1 switches ~15x faster, critical for high-frequency or low switching losses
Operating temperature (TJ)-40°C ~ 125°C-40°C ~ 125°CBoth support same operating temperature range
PackagePG-VSON-10-4 (10-VFDFN Exposed Pad)PG-VDSON-8-4 (8-VDFN Exposed Pad)1EDN7116GXTMA1 has a slightly larger package with more pins
Mounting typeSurface MountSurface MountBoth surface mount
Digikey programmableNot VerifiedNot VerifiedNo programmable options verified for either

Design trade-offs

The most striking difference between these devices is the target application and driving capability. The 1EDN7116GXTMA1 is optimized for high-speed, high-voltage GaN or MOSFET high-side drive with its 200 V bootstrap tolerance and extremely fast 3 ns switching edges. This translates directly to lower switching losses and better efficiency in high-frequency designs (e.g., >1 MHz GaN-based DC-DC converters). The 2 A peak source/sink current is adequate for typical GaN gate charges but may limit edge speed under heavier gate charge loads.

The 2EDL8024GXUMA1, by contrast, doubles the peak drive current to 4 A, which benefits driving larger MOSFETs with higher gate charge and lower R_DS(on). However, its 45 ns rise/fall times are an order of magnitude slower, increasing switching losses and EMI concerns at high frequencies. The dual-channel architecture (high- and low-side) simplifies half-bridge design, reducing component count and layout complexity.

Voltage supply ranges reflect different design goals: 1EDN7116GXTMA1 can operate down to 4.2 V supply, which may ease interfacing with low-voltage logic rails, while 2EDL8024GXUMA1 requires a higher minimum supply of 8 V, consistent with traditional MOSFET gate drive rails. The higher bootstrap voltage rating of 1EDN7116GXTMA1 (200 V vs 90 V) is critical for high-voltage applications, such as automotive or industrial systems operating above 100 V.

Thermal considerations favor the 2EDL8024GXUMA1 for large MOSFETs needing strong gate drive current, but its slower edges may increase switching loss and thermal dissipation overall. The 1EDN7116GXTMA1’s faster switching edges reduce switching loss but may require more careful layout for EMI and ringing mitigation, especially since GaN FETs are sensitive to gate drive voltage and slew rates.

From a layout perspective, the 1EDN7116GXTMA1’s 10-pin PG-VSON package offers more pins for additional functions or flexible routing compared to the 8-pin 2EDL8024GXUMA1. However, the 2EDL8024GXUMA1’s integrated high- and low-side drivers reduce the total component count and PCB area for half-bridge topologies.

Cost at volume is not provided here, but generally, single-channel GaN-capable drivers like 1EDN7116GXTMA1 may command a premium due to their specialized nature, while the 2EDL8024GXUMA1 targets broader MOSFET applications and may be more cost-effective in multi-channel designs.

Use-case fit

Choose 1EDN7116GXTMA1 when…

Choose 2EDL8024GXUMA1 when…

Drop-in compatibility

There is no indication these parts are pin-compatible or footprint-compatible. The 1EDN7116GXTMA1 uses a 10-pin PG-VSON package, while the 2EDL8024GXUMA1 has an 8-pin PG-VDSON package. The pin count and package outline differences mean a direct substitution on the same PCB footprint is not possible without layout changes. Additionally, the 2EDL8024GXUMA1 provides dual channels and requires different wiring for high- and low-side, unlike the single high-side 1EDN7116GXTMA1.

Because the supply voltage ranges and bootstrap voltage ratings differ substantially, substituting one IC for the other without redesigning the power stage and supporting components is not recommended.

Alternatives to consider