UM6K33NTN vs CSD87501L MOSFET Arrays: Technical Comparison for Hardware Design

Quick verdict

For low-current, low-voltage digital switching and signal-level applications, the Rohm UM6K33NTN is the clear choice due to its very low gate threshold (1V) and extremely low continuous drain current rating (200mA), optimized for logic-level drive at 1.2V. For medium- to high-current power switching, the Texas Instruments CSD87501L dominates with continuous source current capability up to 14A, extremely low on-resistance (~7.8mΩ typical), and 2.5W power dissipation, making it suitable for power stages and load switches at voltages up to 30V.

Spec comparison table

SpecUM6K33NTNCSD87501LNotes
Configuration2 × N-Channel2 × N-Channel, Common DrainBoth dual N-channel arrays; TI specifies common drain configuration, Rohm does not
Continuous Drain Current (Id, 25°C)200mANot specified (continuous source current min: 14A, typ: 7A)CSD87501L supports orders of magnitude higher current, critical for power applications
Drain-Source Voltage Max (Vds)50VNot explicitly specified; Source-to-Source Voltage Max 30VUM6K33NTN supports higher voltage; CSD87501L limited to 30V typical
Gate Drive VoltageLogic Level, 1.2V driveLogic LevelUM6K33NTN optimized for lower gate drive voltage; CSD87501L typically driven at 4.5–10V
Gate Threshold Voltage (Vgs_th max)1V @ 1mA2.3V @ 250µAUM6K33NTN turns on at much lower gate voltage, better for low-voltage logic
On-Resistance (Rds_on max @ Id, Vgs)2.2Ω @ 200mA, 4.5V7.8mΩ (typ), source-to-sourceCSD87501L has vastly lower on-resistance, enabling higher efficiency and power handling
Maximum Power Dissipation (Pd)120mW2.5WCSD87501L handles over 20× more power dissipation, suitable for high-power designs
Input Capacitance (Ciss)25pF @ 10V1620pF (typ), 2110pF (max)UM6K33NTN has much lower input capacitance, beneficial for high-speed switching at low current
Gate Charge (Qg max @ Vgs)Not specified40nC @ 10VCSD87501L has significant gate charge, requiring stronger gate drivers
Operating Temperature Range (TJ)Up to 150°C-55°C to 150°CCSD87501L supports wider temperature range on low end
Package Type6-TSSOP / SC-88 / SOT-363 (UMT6)10-Picostar (3.37×1.47 mm) (XFLGA)Different packages, affecting PCB layout and thermal dissipation
Mounting TypeSurface MountSurface MountBoth are surface mount
Gate-to-Source Voltage MaxNot specified±20VCSD87501L supports wider gate voltage range, allowing more rugged gate drive
Gate Leakage Current MaxNot specified10μALow but specified for CSD87501L
Rise Time / Fall TimeNot specified260ns / 712ns (typ)Switching speeds available only for CSD87501L, relevant for PWM and high-speed switching
Human Body Model ESD RatingNot specified2kVCSD87501L specifies ESD robustness
Series Gate ResistanceNot specified300Ω min, 450Ω typInternal gate resistor on CSD87501L can affect switching speed and EMI
Source-to-Source Voltage MaxNot specified30VCSD87501L limited to 30V source-to-source voltage
Pulsed Source Current MinNot specified72ACSD87501L supports high pulsed currents, critical for switching applications

Design trade-offs

The UM6K33NTN is a small-signal MOSFET array targeting very low current, low voltage, and logic-level switching with minimal gate drive requirements. Its Rds(on) of 2.2Ω at 200mA and 4.5V gate drive is modest, and input capacitance of only 25pF means low gate charge and minimal switching losses at low frequencies. This makes it suitable for level shifting, signal multiplexing, or analog switch replacement in low-power digital circuits. The low maximum power dissipation of 120mW tightly limits its continuous current handling and thermal dissipation, so it must be used well within those constraints to avoid overheating.

In contrast, the CSD87501L is a power MOSFET array designed for high-current switching and load driving, with a continuous source current rating of up to 14A min and pulsed current capability of 72A. Its extremely low Rds(on) of 7.8mΩ drastically reduces conduction losses at high currents, improving efficiency in power switching circuits. However, its gate charge is substantial (40nC at 10V), requiring a robust gate driver capable of sourcing/sinking tens of milliamps during switching transitions. The internal gate resistor (300–450Ω) further slows switching edges, which can reduce EMI but may limit switching speed in high-frequency applications.

From a thermal perspective, the CSD87501L’s 2.5W maximum power dissipation and package design (10-pin Picostar) allow for better heat spreading and higher power capability, whereas the UM6K33NTN’s tiny 6-pin UMT6 package and 120mW rating restrict thermal management options. The difference in operating voltage ratings is also significant: UM6K33NTN supports up to 50V drain-source voltage, suitable for slightly higher voltage rail switching compared to the 30V source-to-source max on the CSD87501L.

Layout sensitivity differs substantially. The UM6K33NTN’s low input capacitance and gate charge simplify gate drive design and minimize switching noise in low-current logic-level circuits. The CSD87501L, with its high input capacitance and internal gate resistor, requires careful gate drive loop design, including consideration of gate driver strength, gate resistor selection (if external), and PCB parasitics to optimize switching speed and reduce losses.

Finally, cost and availability at volume may vary: the UM6K33NTN’s small-signal focus and smaller package may reduce cost for low-power designs, while the CSD87501L’s power handling and package complexity likely increase unit cost but justify it in power switching roles.

Use-case fit

Choose UM6K33NTN when…

Choose CSD87501L when…

Drop-in compatibility

There is no indication that the UM6K33NTN and CSD87501L are pin-compatible or footprint-compatible. The UM6K33NTN comes in a 6-pin UMT6 (SOT-363 style) package, while the CSD87501L is in a 10-pin Picostar (XFLGA) package measuring approximately 3.37×1.47mm. The different pin counts and package dimensions mean substituting one for the other will require PCB redesign and schematic changes. Additionally, the CSD87501L’s common drain configuration differs from the UM6K33NTN’s unspecified configuration, possibly requiring circuit re-architecting.

Alternatives to consider