UM6K33NTN vs A89103KETSR-5: Component Comparison for Power Electronics Applications

Quick verdict

For low-current, low-voltage switching and signal-level MOSFET applications, the UM6K33NTN offers a compact, dual N-channel MOSFET array optimized for logic-level drive and low power dissipation. In contrast, the A89103KETSR-5 is a dedicated 3-phase floating gate driver IC designed for driving external high-current MOSFETs or IGBTs in automotive or industrial motor control scenarios, making it the clear choice for complex gate drive implementations requiring isolation and precise timing.

Spec comparison table

SpecUM6K33NTNA89103KETSR-5Notes
Configuration2 N-Channel (Dual)3-Phase Floating Gate Driver ICUM6K33NTN is a discrete MOSFET array; A89103KETSR-5 is an integrated gate driver IC for 3-phase systems.
Continuous Drain Current @ 25°C (Id)200 mANot specifiedUM6K33NTN specifies max continuous current; A89103KETSR-5 drives external MOSFETs, so current depends on load.
Drain-Source Voltage Max (Vds)50 V4.5 V ~ 85 V supply voltageUM6K33NTN MOSFET max Vds is 50 V; A89103KETSR-5 operates from 4.5 V to 85 V supply, suitable for higher voltages.
FET FeatureLogic Level Gate, 1.2 V driveMOSFET (N-Channel) gate driverUM6K33NTN is logic-level MOSFET; A89103KETSR-5 is a gate driver IC, not a MOSFET itself.
Gate Charge (Qg)Not specifiedNot specifiedNo data to compare; gate charge important for switching speed and efficiency but unavailable here.
Input Capacitance (Ciss)25 pF @ 10 VNot specifiedUM6K33NTN input capacitance is low, aiding switching speed at logic levels; no data for A89103KETSR-5.
Mounting TypeSurface MountSurface MountBoth are surface mount, but packages differ significantly in size and pin count.
Operating Temperature RangeUp to 150°C (TJ)-40°C to 150°C (TA)A89103KETSR-5 specifies ambient temp range; UM6K33NTN specifies junction temp. Both rated to 150°C max.
Package Case6-TSSOP (UMT6, SC-88, SOT-363)28-QFN (5x5 mm) with Exposed PadUM6K33NTN is a small 6-pin MOSFET array; A89103KETSR-5 is a larger 28-pin QFN IC with thermal pad.
Maximum Power Dissipation120 mWNot specifiedUM6K33NTN limits dissipation to 120 mW; A89103KETSR-5 power dissipation depends on load and driver losses.
Rds(on) Max @ Id, Vgs2.2 Ω @ 200 mA, 4.5 VNot specifiedUM6K33NTN’s Rds(on) is relatively high, suitable for low current; A89103KETSR-5 is a driver IC, no Rds(on).
Threshold Voltage (Vgs_th)1 V @ 1 mANot specifiedUM6K33NTN threshold is low, consistent with logic-level drive; no data for A89103KETSR-5.
Supplier Device PackageUMT628-QFN (5x5)Package size and pin count differ significantly, reflecting different use cases.
TechnologyMOSFET (Metal Oxide)Floating Gate Driver ICUM6K33NTN is discrete MOSFET device; A89103KETSR-5 is a complex IC for gate driving.
Number of Drivers2 (internal MOSFETs)3 driversUM6K33NTN has two MOSFETs; A89103KETSR-5 drives three phases independently.
Logic Voltage (VIL / VIH)Not specified0.8 V (low), 2 V (high)A89103KETSR-5 input logic thresholds defined for interface with digital control signals.
Rise/Fall Time (typical)Not specified1.2 µs (rise), 150 ns (fall)A89103KETSR-5 specifies switching speed metrics important for timing-critical gate drive.
QualificationNot specifiedAEC-Q100 (automotive grade)A89103KETSR-5 is automotive qualified, suitable for harsh environments; UM6K33NTN has no stated qualification.

Design trade-offs

The UM6K33NTN is a simple, low-voltage dual N-channel MOSFET array designed for low-current switching applications, such as signal routing or low-power load switching. Its 2.2 Ω Rds(on) at 200 mA and 4.5 V gate drive is relatively high, limiting conduction efficiency at higher currents, but its logic-level gate threshold (1 V @ 1 mA) enables direct drive from low-voltage digital logic without additional gate drive circuitry. The 25 pF input capacitance supports fast switching at low currents. Its small 6-pin UMT6 package is ideal for space-constrained designs but offers limited power handling (120 mW max), requiring careful thermal management if used near the current limit.

In contrast, the A89103KETSR-5 is a specialized floating gate driver IC intended to drive external power MOSFETs or IGBTs in three-phase motor control or power conversion applications. It supports a wide supply voltage range (4.5 V to 85 V), allowing integration into high-voltage systems. The internal gate drivers are optimized for timing and isolation, with defined rise and fall times (1.2 µs and 150 ns) critical for efficient switching and dead-time control. Its automotive-grade qualification (AEC-Q100) ensures reliability in harsh environments, and the 28-pin QFN package includes an exposed pad for improved thermal dissipation.

From a layout perspective, UM6K33NTN’s small footprint and simple two-MOSFET array mean straightforward PCB design with minimal external components. The A89103KETSR-5 requires careful layout to manage switching noise, thermal dissipation, and gate drive loop inductances, especially since it handles three independent outputs and floating high-side drives. Firmware must handle non-inverting inputs and timing constraints, whereas UM6K33NTN MOSFETs are passive devices needing no firmware interaction beyond basic switching.

Cost-wise, UM6K33NTN likely has a lower unit cost due to simpler function and smaller package, but it is limited to low current, low voltage, and simple switching. The A89103KETSR-5, being a complex IC with automotive qualification and integrated gate drivers, will be more expensive but enables integration of multiple gate drives with protection features and timing control, reducing system complexity and component count in motor drives or inverter designs.

Use-case fit

Choose UM6K33NTN when…

Choose A89103KETSR-5 when…

Drop-in compatibility

These parts are not pin- or footprint-compatible. The UM6K33NTN is a 6-pin MOSFET array in a small UMT6 package, whereas the A89103KETSR-5 is a 28-pin QFN IC with an exposed pad. The functional roles differ significantly: UM6K33NTN is a discrete MOSFET array, and A89103KETSR-5 is an integrated gate driver IC for three-phase applications. Substituting one for the other would require major circuit redesign, including layout, power stage components, and firmware.

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