NX3008NBKS,115 vs NTHL040N120M3S: Component Comparison for Power Electronics Engineers

Quick verdict

For low-voltage, low-current applications such as signal switching or level shifting in automotive or industrial contexts, the NX3008NBKS,115 dual MOSFET array offers a compact, logic-level solution with an automotive-grade qualification. Conversely, for high-voltage, high-current power conversion or motor drives requiring 1200 V blocking and tens of amps continuous current, the NTHL040N120M3S SiC MOSFET provides a robust, high-power discrete transistor with lower conduction losses at high current and superior thermal handling.

Spec comparison table

SpecNX3008NBKS,115NTHL040N120M3SNotes
Product typeMosfet Array (2 N-Channel)N-Channel discrete MOSFETArray vs discrete transistor affects integration and layout flexibility
Drain-Source Voltage (Vds max)30 V1200 VNTHL040N120M3S supports much higher voltages, suitable for mains or HV applications
Continuous Drain Current (Id @ 25°C)350 mA54 A (Tc)NTHL040N120M3S supports 150× higher current, for power stage use
Drain Current Spiking Max1.4 ANot specifiedNX3008NBKS,115 can handle brief surges up to 1.4 A
Rds(on) Typ @ Tj=25°C1.0–1.4 Ω @ 350 mA, 4.5 V54 mΩ @ 20 A, 18 VNTHL040N120M3S has orders of magnitude lower Rds(on) at high current, critical for efficiency
Gate Threshold Voltage (Vgs_th typ)0.6–1.1 V @ 250 µA4.4 V @ 10 mANX3008NBKS,115 is logic-level, switching fully on below 2 V; NTHL040N120M3S requires higher drive voltage
Gate Charge (Qg typ / max)0.52–0.68 nC @ 4.5 V75 nC @ 18 VNX3008NBKS,115 gate charge is ~100× lower, easing gate drive power and switching losses
Input Capacitance (Ciss max)50 pF @ 15 V1700 pF @ 800 VNX3008NBKS,115 has much lower input capacitance, beneficial for high-speed switching at low voltage
Output Capacitance (Coss typ)6.5 pFNot specifiedLower output capacitance reduces switching losses in NX3008NBKS,115
Reverse Transfer Capacitance (Crss typ)2.2 pFNot specifiedLower Crss reduces Miller effect, improving switching performance in NX3008NBKS,115
Power Dissipation (Pd max)445 mW (surface mount)231 W (at Tc, through hole)NTHL040N120M3S handles ~500× higher power, suitable for high-power applications
Package6-TSSOP (surface mount)TO-247-3 (through hole)Different mounting and thermal handling methods, affects PCB design and cooling
Operating Temperature Range (TJ)-55°C to +150°C-55°C to +175°CNTHL040N120M3S supports higher TJ max, better for harsh thermal environments
ESD Rating2000 VNot specifiedNX3008NBKS,115 has defined ESD rating, useful for automotive-grade applications
Transient Thermal Impedance (typ)0.01–1 K/W (various time scales)Not specifiedNX3008NBKS,115 datasheet gives detailed transient thermal impedance
Gate Voltage Max/Min±8 V+22 V / -10 VNTHL040N120M3S supports higher gate drive voltages but requires more robust drive circuitry
TechnologyMOSFET (Silicon)SiC FET (Silicon Carbide)SiC offers faster switching, higher voltage, and better thermal performance
QualificationAEC-Q101 (Automotive Grade)None specifiedNX3008NBKS,115 is automotive qualified, important for reliability in automotive designs

Design trade-offs

The NX3008NBKS,115 is a dual N-channel MOSFET array optimized for low-voltage, low-current switching with logic-level gate drive. Its 30 V rating and 350 mA continuous current limit make it suitable for signal-level applications such as load switches, level translators, or small relay replacements. The low gate charge (~0.6 nC) and low input/output capacitances minimize switching losses and EMI at modest switching speeds. The 6-TSSOP package allows high-density PCB layouts in compact assemblies, and the AEC-Q101 qualification ensures automotive-grade reliability under harsh conditions.

In contrast, the NTHL040N120M3S is a high-voltage (1200 V), high-current (54 A) discrete SiC MOSFET designed for demanding power electronics like motor drives, power supplies, and inverters. The significantly lower Rds(on) of 54 mΩ at 20 A reduces conduction losses substantially compared to the NX3008NBKS,115, but only when driven at the specified 18 V gate voltage. The large gate charge (75 nC) and input capacitance (1700 pF) mean higher gate drive power and slower switching transitions unless carefully managed with robust gate drivers and layout.

Thermally, the TO-247-3 package and 231 W power dissipation rating of the NTHL040N120M3S allow it to handle heavy power loads with appropriate heat sinking, whereas the NX3008NBKS,115’s 445 mW dissipation and small surface-mount package necessitate careful power budgeting and thermal management, limiting it to low-power use. The SiC technology in the NTHL040N120M3S enables faster switching and higher temperature operation (up to 175°C junction), but the higher gate voltage and drive requirements complicate gate driver selection and PCB layout.

From a firmware and system design perspective, the NX3008NBKS,115’s logic-level drive simplifies control and reduces the need for gate driver ICs or level shifting. The NTHL040N120M3S demands dedicated gate drivers capable of supplying higher voltages and currents to switch efficiently and avoid device stress. The larger physical size of the NTHL040N120M3S also impacts PCB area and thermal design, contrasting with the compact footprint of the NX3008NBKS,115.

Cost-wise, the NX3008NBKS,115 is likely less expensive at volume due to silicon CMOS process and small package size, but limited in power handling. The NTHL040N120M3S, as a SiC discrete device, carries a premium but enables designs that cannot be realized with silicon MOSFET arrays at similar voltage and current levels.

Use-case fit

Choose NX3008NBKS,115 when…

Choose NTHL040N120M3S when…

Drop-in compatibility

These parts are neither pin-compatible nor footprint-compatible. The NX3008NBKS,115 is a dual MOSFET array in a 6-TSSOP surface-mount package with a small outline (2.2 mm x 1.35 mm), while the NTHL040N120M3S is a high-power discrete transistor in a through-hole TO-247-3 package. Substituting one for the other would require complete redesign of the PCB footprint, gate drive circuitry, and thermal management approach. There is no direct drop-in substitution possible.

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