NX3008NBKS,115 vs CSD17483F4: Component Comparison for Power Electronics Designers

Quick verdict

For low-current logic-level switching and signal-level multiplexing, the NX3008NBKS,115 dual MOSFET array is the better choice due to its integrated dual device, low gate charge (~0.68 nC @ 4.5 V), and automotive-grade qualification. For higher-current switching or power load applications up to 1.5 A, the CSD17483F4 offers superior current handling, lower R_DS(on) (240 mΩ @ 500 mA, 8 V) and higher power dissipation, making it preferable for power switching and load driving.

Spec comparison table

SpecNX3008NBKS,115CSD17483F4Notes
Product URLNX3008NBKS,115CSD17483F4
Configuration2 N-Channel (Dual)Single N-ChannelNX3008NBKS,115 integrates two devices, saving board space for dual switch needs
Absolute max drain-source voltage (V_DS)30 V30 VEqual voltage rating
Continuous drain current (I_D) @ 25 °C350 mA1.5 ACSD17483F4 supports >4x higher continuous current
Drain current spiking max1.4 ANot specifiedNX3008NBKS,115 limited to 1.4 A spike current
Power dissipation max (P_D)445 mW (device), 990 mW (total)500 mW (Ta)CSD17483F4 slightly higher power handling capability
R_DS(on) @ 25°C1.0–1.4 Ω @ 350 mA, 4.5 V (typ)240 mΩ @ 500 mA, 8 V (max)CSD17483F4 has significantly lower on-resistance, reducing conduction losses
Gate charge Q_g @ 4.5 V0.52–0.68 nC (typ)1.3 nC (max)NX3008NBKS,115 requires less gate charge, easing gate drive
Input capacitance C_iss @ 15 V50 pF190 pFNX3008NBKS,115 has ~4x lower input capacitance, improving switching speed and lower drive losses
Output capacitance C_oss @ 25 °C6.5 pF (typ)Not specifiedNX3008NBKS,115 lower output capacitance reduces switching losses
Reverse transfer capacitance C_rss2.2 pF (typ)Not specifiedNX3008NBKS,115 lower C_rss reduces Miller effect, improving switching behavior
Gate threshold voltage V_GS(th)0.5–1.1 V (typ/max @ 250 µA)1.1 V @ 250 µANX3008NBKS,115 has lower gate threshold, better for low-voltage logic drive
Max gate-source voltage V_GS±8 V12 VCSD17483F4 can tolerate higher gate voltages
Operating temperature range-55 °C to +150 °C-55 °C to +150 °CEquivalent operating temperature range
Package6-TSSOP (SC-88, SOT-363)3-XFDFN (PICOSTAR)Different packages; NX3008NBKS,115 is dual device in 6-pin, CSD17483F4 is single device
Package dimensions (L x W)2.2 mm x 1.35 mmNot specifiedNX3008NBKS,115 smaller footprint but dual device; CSD17483F4 package smaller single MOSFET
ESD rating2000 VNot specifiedNX3008NBKS,115 has specified ESD rating
TechnologyMOSFET (Metal Oxide)MOSFET (Metal Oxide)Equivalent technology
Grade / QualificationAutomotive grade, AEC-Q101Not specifiedNX3008NBKS,115 qualified for automotive use
Thermal resistance junction-to-ambient (typ)300 K/W (device), 390-445 K/W (per transistor)Not specifiedNX3008NBKS,115 thermal resistance data available, no data for CSD17483F4
Gate leakage current (typical @ 25°C)0.2–1 µANot specifiedNX3008NBKS,115 low gate leakage
Rise / fall / turn-on/off times (typ @ 25°C)t_rise 11 ns, t_fall 19 ns, t_on delay 15–30 ns, t_off delay 69–138 nsNot specifiedNX3008NBKS,115 provides switching time data

Design trade-offs

The NX3008NBKS,115 is a dual N-channel MOSFET array designed for low current applications, such as signal switching, level shifting, or load switching up to 350 mA per channel. Its logic-level gate drive (V_GS(th) as low as 0.5 V) and low gate charge (~0.68 nC @ 4.5 V) make it easy to drive directly from low-voltage MCUs or digital logic without dedicated gate drivers. The low input capacitance (50 pF) and reverse transfer capacitance (2.2 pF) mean lower switching losses and reduced electromagnetic interference (EMI) in fast switching applications, albeit limited by the relatively high R_DS(on) of ~1.0–1.4 Ω at 350 mA. The dual device in a single 6-TSSOP package saves PCB area and simplifies routing for applications requiring two switches. Its automotive-grade qualification (AEC-Q101) also makes it suitable for harsh environments.

In contrast, the CSD17483F4 targets higher current loads with a continuous drain current rating of 1.5 A and a much lower R_DS(on) of 240 mΩ at 500 mA and 8 V gate drive. This results in substantially lower conduction losses at moderate currents. However, it requires a higher gate charge (1.3 nC @ 4.5 V) and higher gate voltage tolerance (up to 12 V), which means a stronger gate driver stage or dedicated MOSFET driver IC is advisable to switch efficiently. The input capacitance is almost 4x higher at 190 pF, which may increase switching losses and EMI if switching frequencies are high. The package difference (3-pin XFDFN vs 6-TSSOP) means layout considerations differ, and the single device means you need two separate MOSFETs if dual switches are required.

Thermally, the NX3008NBKS,115 specifies thermal resistance and power dissipation limits clearly, though the low current and high R_DS(on) restrict its use in power applications. The CSD17483F4’s higher power dissipation rating (500 mW) and lower on-resistance position it better for small power switching tasks, but thermal management is still critical at or near its current limits. The higher gate drive voltage and charge impact driver selection and power consumption in switching circuits.

Cost at volume is not provided but generally, MOSFET arrays like the NX3008NBKS,115 can reduce BOM and assembly costs for dual-switch applications, while single discrete MOSFETs like the CSD17483F4 may be cheaper per device but require more PCB area and assembly steps for dual configurations.

Use-case fit

Choose NX3008NBKS,115 when…

Choose CSD17483F4 when…