NX3008NBKS,115 vs AUIRFZ44N: Component Comparison for Power Electronics Engineers

1. Quick verdict

For low-voltage, low-current switching applications requiring a compact, surface-mount dual MOSFET with logic-level drive and automotive qualification, the NX3008NBKS,115 is the clear choice due to its integrated dual device and low gate charge. For high-current, higher-voltage power stages, such as motor drives or power supplies with through-hole mounting and robust thermal handling, the AUIRFZ44N dominates, offering 49A continuous current at 55V and significantly lower R_DS(on).

2. Spec comparison table

SpecNX3008NBKS,115AUIRFZ44NNotes
Product typeMosfet Array 2x N-Channel DualSingle N-Channel MOSFETNX3008NBKS has two MOSFETs in one package; AUIRFZ44N is a single device
Drain-source voltage (V_DS max)30 V55 VAUIRFZ44N supports almost double voltage, better for higher voltage applications
Continuous drain current (I_D @ 25°C)350 mA49 A (at case temp)AUIRFZ44N handles over 100x current; NX3008NBKS limited to low current
Power dissipation (max)445 mW94 W (at case temp)AUIRFZ44N has much higher power dissipation capability
Package6-TSSOP (surface mount)TO-220-3 (through hole)NX3008NBKS is compact surface mount; AUIRFZ44N is larger through-hole
Gate charge (Q_g @ V_GS)0.68 nC @ 4.5 V63 nC @ 10 VNX3008NBKS has dramatically lower gate charge, hence lower switching losses
R_DS(on) (typical @ I_D, V_GS)1.4 Ω @ 350 mA, 4.5 V17.5 mΩ @ 25 A, 10 VAUIRFZ44N has orders of magnitude lower on-resistance, critical for efficiency at high current
Gate threshold voltage (V_GS(th))0.6–1.1 V (typ)4 V @ 250 µANX3008NBKS is logic-level gate, easier to drive from low-voltage logic
Input capacitance (C_iss)34–50 pF (typ)1470 pF @ 25 VNX3008NBKS has much lower input capacitance, reducing gate drive current
Output capacitance (C_oss)6.5 pF (typ)Not specifiedLower output capacitance reduces switching losses; NX3008NBKS favored
Reverse transfer capacitance (C_rss)2.2 pF (typ)Not specifiedLower C_rss reduces Miller effect; NX3008NBKS better here
ESD rating2000 VNot specifiedNX3008NBKS has defined ESD rating, helpful in sensitive designs
Ambient temperature range-55 °C to +150 °C-55 °C to +175 °CAUIRFZ44N supports higher max temperature
Thermal resistance (junction to ambient)300 K/W (device typical)Not specifiedNX3008NBKS has high thermal resistance typical of small SMT package
Transient thermal impedance (typical)~0.5 K/W (100 ms)Not specifiedNX3008NBKS transient thermal impedance data provided; AUIRFZ44N data lacking
Max gate-source voltage (V_GS max)±8 V±20 VAUIRFZ44N tolerates higher gate drive voltages
Mounting typeSurface MountThrough HoleDifferent mounting styles affect assembly and thermal management
QualificationAEC-Q101AEC-Q101Both suitable for automotive use
Number of channels2 (dual)1NX3008NBKS integrates two MOSFETs, useful for half-bridge or complementary switching
Drain current spiking max1.4 ANot specifiedNX3008NBKS supports brief spike currents ~4x nominal
Gate leakage current (typ)0.2 µA @ 25 °CNot specifiedNX3008NBKS low gate leakage reduces static power losses
Gate drive voltage for R_DS(on) rating4.5 V10 VNX3008NBKS designed for logic-level drive; AUIRFZ44N requires higher gate voltage

3. Design trade-offs

The NX3008NBKS,115 and AUIRFZ44N serve fundamentally different roles in power electronics despite both being N-channel MOSFETs. The NX3008NBKS is a dual, low-voltage, low-current MOSFET array optimized for signal switching or low-power loads, packaged in a tiny 6-TSSOP surface-mount package. Its logic-level gate threshold (~0.6–1.1 V) and extremely low gate charge (~0.68 nC at 4.5 V) minimize gate drive losses and simplify direct MCU or low-voltage gate drive interfacing. However, its high R_DS(on) (~1.4 Ω at 350 mA) and low current rating limit it to sub-amp applications. Its thermal resistance (~300 K/W) and low power dissipation (445 mW max) further restrict it to low power or signal-level switching.

In contrast, the AUIRFZ44N is a power MOSFET intended for high-current, medium-voltage switching, capable of 49 A continuous current and 55 V drain-source voltage, housed in a through-hole TO-220 package with robust thermal dissipation (94 W max at case temperature). Its low R_DS(on) of 17.5 mΩ at 25 A and 10 V gate drive makes it suitable for power stages where conduction losses matter. The trade-off is a significantly higher gate charge (~63 nC at 10 V), which demands a stronger gate driver and more careful gate drive waveform design to avoid switching losses and EMI. The AUIRFZ44N requires a 10 V gate drive for rated R_DS(on), incompatible with direct logic-level drive.

From a layout perspective, the NX3008NBKS’s small package and dual MOSFET structure simplify compact PCB designs for low-power switching but limit heat sinking options. The AUIRFZ44N’s through-hole TO-220 package enables direct heatsink mounting, improving thermal performance for high-power applications but increases PCB real estate and assembly complexity. The AUIRFZ44N’s higher gate voltage rating (±20 V vs ±8 V) offers more gate drive margin, useful in noisy automotive environments.

Cost at volume tends to favor the NX3008NBKS for low-power, space-constrained designs due to integration and SMT assembly, while the AUIRFZ44N remains cost-effective for power stages requiring high current and robust thermal handling, especially where through-hole parts are standard for heat dissipation.

4. Use-case fit

Choose NX3008NBKS,115 when:

Choose AUIRFZ44N when:

5. Drop-in compatibility

The NX3008NBKS,115 and AUIRFZ44N are not pin-compatible nor footprint-compatible. NX3008NBKS is a dual MOSFET array in a 6-TSSOP surface-mount package with small pins and a different pinout, while the AUIRFZ44N is