Key Specs

SpecValueConditionSource
Output ConfigurationPositiveDigi-Key
Output TypeFixedDigi-Key
Number Of Regulators1Digi-Key
Input Voltage (Max)6VDigi-Key
Output Voltage (Min)3VDigi-Key
Output Voltage (Max)-Digi-Key
Voltage Dropout (Max)0.35V @ 250mADigi-Key
Output Current (Max)250mADigi-Key
Current Quiescent IQ4 µADigi-Key
Psrr44dB (100Hz)Digi-Key
Control Features-Digi-Key
Protection FeaturesOver Current, Over Temperature, Short CircuitDigi-Key
Operating Temperature Range-40°C ~ 125°CDigi-Key
Mounting TypeSurface MountDigi-Key
Package Case6-VDFN Exposed PadDigi-Key
Supplier Device Package6-DFN (2x2)Digi-Key

When To Use

  1. 3.3V rail for microcontroller @ 250mA: The maximum output current of 250mA at a dropout voltage of 0.35V makes this device ideal for powering MCUs and low-power analog blocks from a 3.6V lithium battery or similar sources. Using a switching regulator here could add complexity and noise, while an LDO without overtemperature and short-circuit protection risks permanent damage under fault conditions.

  2. Battery-powered sensor node @ 50mA: With a typical quiescent current of 1.6µA and a low dropout voltage, this regulator extends battery life while maintaining a stable 3.0V output. A synchronous buck controller would improve efficiency but add switching noise, which can disturb sensitive analog front-ends.

  3. Post-switching regulator cleanup @ 5V, 200mA: The 44dB PSRR at 100Hz and ±0.4% voltage tolerance at 25°C ensure clean, low-noise output for sensitive circuitry after a noisy DC/DC stage. A buck converter alone would fail to deliver the low noise floor required, resulting in degraded signal integrity.

When Not To Use

  1. Load current > 250mA continuous: The 250mA max output current rating is limiting here. Use a multi-phase buck controller to handle higher loads without thermal or current-limit issues.

  2. Input voltage > 6V or wide input range >6V: The 6V max input rating disqualifies this device for higher voltage rails. Use a synchronous buck controller to efficiently step down from higher voltages and avoid device breakdown.

  3. Quiescent current critical in always-on μA sleep mode: Although the typical IQ is low, the max quiescent current can reach 4µA, which may be too high for coin-cell or ultra-low-power designs. Use a low-IQ PFM buck for extended battery life in such scenarios.

Application Notes

Pin numbers are package-specific. Verify against the datasheet pinout diagram before routing.

Gotchas

  1. [Output capacitor ESR too high]: The datasheet specifies ESR max of 2Ω but ceramic caps with excessive ESR or polymer caps with unknown ESR can cause instability or oscillation. Symptoms include output voltage ringing or periodic dips under load step. Fix by verifying ESR with an LCR meter and use X7R ceramics ≥1µF close to the OUT pin.

  2. [Thermal shutdown triggering under marginal conditions]: The internal shutdown threshold (~140°C) can be reached during transient load spikes or elevated ambient temperature if the PCB thermal pad is insufficient. The regulator then disables output, causing intermittent resets. Fix with proper thermal pad layout and derate load current for ambient >85°C.

  3. [Ground reference shift due to exposed pad current]: Since the exposed pad connects internally to GND, routing heavy currents through the thermal pad return path causes ground offset, shifting output voltage and reducing accuracy. Observed as output voltage varying with load. Fix by separating power return currents from signal ground via PCB layout.

  4. [Minimum input voltage margin not met]: The device requires VIN ≥ 2.3V and VIN ≥ (VOUT + dropout). If the input voltage approaches output voltage plus dropout, the regulator can drop out, causing output voltage collapse during load transients. Symptoms include output dips and unstable startup. Fix by ensuring at least 0.35V headroom at maximum load current.