MCP1402T-E/OT vs STGAP2SICSTR Gate Driver ICs: A Detailed Comparison

Quick verdict

For simple low-side MOSFET/IGBT drive without isolation and limited board space, the MCP1402T-E/OT is the more straightforward and compact choice, offering clean, fast drive up to 500mA peak current. For applications requiring galvanic isolation, high transient immunity, and significantly higher drive current (4A peak), especially in half-bridge or isolated gate drive configurations, the STGAP2SICSTR is the clear winner despite a larger footprint and more complex supply requirements.


Spec comparison table

SpecMCP1402T-E/OTSTGAP2SICSTRNotes
Channel typeSingleSingleBoth single-channel devices.
Current peak output source/sink500mA / 500mA4A / 4AST device offers 8x higher peak current, critical for driving large MOSFET gates fast.
Driven configurationLow-SideNot explicitly stated (isolated gate driver)MCP1402T-E/OT explicitly low-side, ST is isolated driver suitable for high/low side.
Gate typeIGBT, MOSFET (N/P-Channel)MOSFET (N-Channel implied)MCP1402T-E/OT supports both IGBT and MOSFET; ST focuses on MOSFETs.
Input typeNon-invertingTTL/CMOS with hysteresisST input has hysteresis improving noise immunity; MCP1402T-E/OT no hysteresis.
Logic voltage V_IL / V_IH0.8V / 2.4V0.29·VDD to 0.37·VDD / 0.62·VDD to 0.70·VDDST’s input thresholds scale with VDD and are tighter, better for 3.3/5V logic.
Supply voltage range4.5V to 18VLogic supply 3V ~ 5.5V, Positive supply ~14.6V to 16.4VMCP covers wider supply range; ST requires dual supplies (logic + high voltage).
Operating temperature range-40°C to 150°C-40°C to 125°CMCP1402T-E/OT supports higher max temp, useful in harsher environments.
Package / caseSOT-23-5 (SC-74A, SOT-753)8-SOIC (7.5mm width)MCP1402T-E/OT is compact SOT-23; ST is larger SOIC-8.
Rise / fall time typical19ns / 15ns30ns / 30nsMCP is faster switching, beneficial for tight timing and less switching loss.
Propagation delay (max)Not specified90ns (TPLH and TPHL)MCP likely lower delay given rise/fall times but not specified; ST delay is significant.
Pulse width distortion maxNot specified20nsST includes this spec, indicating some timing distortion to account for.
Common mode transient immunityNot specified100 V/nsST designed for high CMTI, important in noisy isolated environments.
Isolation voltageNone5000Vrms (galvanic isolation)ST provides galvanic isolation, a key differentiator.
Supply current (typical)Not specified1.3 mA quiescent, 1.8 mA active; standby 55-550 µAST’s quiescent currents are low for isolation drivers but higher than small MCP parts.
Safe clamp voltageNot specified2.3VST includes safe clamp feature controlling gate voltage undershoot.
Maximum switching frequencyNot specified1 MHzST explicitly supports up to 1 MHz switching frequency.
Output voltage max (driver output)Up to supply voltage (max 18V)VH+0.3V (max ~16.7V)MCP can run up to 18V, ST limited to about 16.4V supply max.
Thermal resistance junction-to-ambientNot specified120 °C/W (typ)ST’s thermal resistance is moderate; MCP data not specified but smaller package likely higher.
Storage temperature range-40°C to 150°C-40°C to 150°CEquivalent storage temperature range.
Human body model ESD protectionNot specified2 kVST gives ESD rating; MCP data not listed.
Mounting typeSurface mountSurface mountBoth SMT devices.
Number of drivers11Single channel each.
Package pin count5 pins8 pinsST pin count higher due to isolation and more complex supply/return paths.
Logic input bias currentNot specified33 µA minST’s input bias current is moderate, influenced by isolation circuitry.

Design trade-offs

Drive current and switching speed: The MCP1402T-E/OT provides 500mA peak source/sink current, sufficient for low to moderate gate charge MOSFETs or IGBTs in low-side configurations. Its rise/fall times of ~15–19ns support efficient switching with minimal losses. The STGAP2SICSTR, by contrast, can source and sink up to 4A peak, making it suitable for driving large MOSFETs with high gate charge or in half-bridge topologies requiring fast transitions to reduce switching losses. However, its rise/fall times are slower (30ns typical), partly due to the isolation barrier and internal coupling technology.

Isolation and noise immunity: The most significant functional difference is that the STGAP2SICSTR provides galvanic isolation rated at 5000Vrms, with a common-mode transient immunity (CMTI) of 100 V/ns. This makes it suitable for applications where the driver must be referenced to a floating or high-voltage domain, such as isolated half-bridge or motor drives. The MCP1402T-E/OT has no isolation, limiting it to low-side or non-isolated gate drive. The ST’s isolation dramatically increases design complexity (extra supply rails, layout constraints) but is mandatory in many industrial and automotive applications.

Supply voltage and power considerations: The MCP1402T-E/OT supports a wide supply range from 4.5V to 18V, allowing flexible use with different gate voltages and simpler power supply requirements. The ST device requires separate logic and high-voltage supplies (logic supply 3–5.5V, high-voltage supply nominally ~15.5V), adding BOM cost and complexity. ST’s quiescent currents (1.3–1.8mA active, 40–550µA standby) are reasonable but higher than typical non-isolated drivers, impacting efficiency in low-power standby modes.

Package and PCB layout: The MCP1402T-E/OT is a small 5-pin SOT-23-5 package, ideal for space-constrained designs and simple low-side drivers. The STGAP2SICSTR comes in an 8-pin SOIC, larger in footprint and with additional pins for isolation and supply, requiring more PCB area and careful layout. The ST datasheet provides detailed layout guidelines critical to maintain isolation integrity and minimize noise coupling. The MCP part is simpler to place and route, especially in dense boards.

Thermal and environmental: MCP1402T-E/OT supports operation up to 150°C junction temperature, useful in harsh environments or thermally constrained designs. STGAP2SICSTR max operating junction temperature is 125°C, which is typical for isolated drivers but more limited than MCP’s rating. Thermal resistance data are only available for ST (120°C/W typical), indicating moderate heat dissipation; MCP data is absent but smaller package likely has higher thermal resistance, requiring careful thermal management at high current.


Use-case fit

Choose MCP1402T-E/OT when:

Choose STGAP2SICSTR when: