MCP1402T-E/OT vs STGAP2SICSC: Gate Driver IC Comparison

Quick verdict

For straightforward low-side MOSFET or IGBT gate drive in compact, cost-sensitive designs running at moderate voltage and current (up to 500mA peak), the MCP1402T-E/OT is the practical choice due to its simplicity, small SOT-23 footprint, and broad supply range. For isolated gate driving requiring high peak output current (up to 4A), galvanic isolation, and operation in high-voltage or safety-critical environments, the STGAP2SICSC is the clear winner, despite larger size and more complex layout requirements.


Spec comparison table

SpecMCP1402T-E/OTSTGAP2SICSCNotes
Channel typeSingleSingleBoth single-channel drivers.
Peak output current source/sink500mA / 500mA4A / 4ASTGAP2SICSC provides 8x higher peak current, enabling faster switching of large MOSFETs/IGBTs.
Driven configurationLow-SideNot explicitly stated (isolated driver)MCP1402T-E/OT is low-side only, STGAP2SICSC is isolated (capacitive coupling).
Gate type supportedIGBT, N/P-channel MOSFETNot explicitly statedMCP1402T-E/OT supports typical power transistors; ST device designed for MOSFETs, but details sparse.
Input typeNon-invertingTTL/CMOS with hysteresis (3.3V to 5V)STGAP2SICSC input compatible with 3.3/5V logic, MCP1402T-E/OT VIH=2.4V typical.
Logic voltage V_IL / V_IH0.8V / 2.4V0.33·VDD / 0.66·VDD (typ)STGAP2SICSC input thresholds scale with supply voltage, more flexible input interface.
Supply voltage4.5V ~ 18V3V ~ 5.5V (logic), 14.6V turn-on thresholdMCP1402T-E/OT supports wide supply range; ST device logic supply limited to 5.5V, but gate supply up to 26V.
Operating temperature range-40°C ~ 150°C (TJ)-40°C ~ 125°CMCP1402T-E/OT supports higher max junction temperature.
PackageSOT-23-5 (SC-74A)8-SOIC (7.5mm width)MCP1402T-E/OT smaller footprint, better for space-constrained designs.
Rise / Fall time (typical)19ns / 15ns30ns / 30nsMCP1402T-E/OT switches faster, beneficial for high-frequency switching with lower losses.
Isolation voltageNone5000 VrmsSTGAP2SICSC offers galvanic isolation suitable for high-voltage domains; MCP1402T-E/OT has none.
Common mode transient immunityNot specified≥ 100 V/nsST device handles high dv/dt environments better.
Supply current (standby)Not specified65 µA max, 400 µA minSTGAP2SICSC standby currents specified; low standby current beneficial for power saving.
Propagation delay (typ)Not specified75 ns (on/off typical)STGAP2SICSC has longer propagation delay, may impact timing in fast switching applications.
Maximum switching frequencyNot specified1 MHz (typical)ST device rated for 1 MHz switching frequency.
Clamp short-circuit current maxNot specified5 ASTGAP2SICSC includes clamp feature for short-circuit protection, useful in rugged applications.
Package lengthNot specified (SOT-23 typical)2.64 mm (typ)ST package physically larger, impacts PCB layout.
Package width~2.9 mm (typical SOT-23)7.5 mmMCP1402T-E/OT much smaller footprint.
Operating junction temperature max150°C125°CMCP1402T-E/OT supports higher junction temp.
Storage temperature rangeNot specified-50°C to 150°CST device storage temp wider on low end.
Input bias current maxNot specified70 µAST device input bias current low, reducing input drive requirements.
Input pull-down resistorNot specified100 kΩ (typ)ST device includes internal pull-down, simplifies input wiring.
PCB layout guidelinesNot specifiedPlace SMT ceramic capacitors close to supply pins; avoid traces below driverSTGAP2SICSC layout sensitive due to isolation and capacitive coupling.
Thermal resistance junction-to-ambientNot specified120 °C/W (typ)ST device thermal resistance relatively high, requires thermal management consideration.
Supply voltage turn-on/off thresholdsNot specified14.6 V / 14.8 V (typ)ST device has UVLO with turn-on/turn-off thresholds, useful for supply sequencing.
Wake-up timeNot specified20 µs (typ)ST device requires wake-up time after supply applied, affects startup sequencing.
Isolation technologyNoneCapacitive couplingST device uses capacitive coupling isolation, enabling high isolation voltage but more complex design.

Design trade-offs

The most fundamental difference between these two drivers is the isolation feature of the STGAP2SICSC versus the non-isolated MCP1402T-E/OT. The ST device’s capacitive coupling isolation supports 5 kVrms isolation voltage, making it suitable for driving high-side or floating MOSFETs/IGBTs in half-bridge or full-bridge applications where galvanic isolation is mandatory. In contrast, the MCP1402T-E/OT is a low-side driver intended for direct ground-referenced MOSFET or IGBT control, with no isolation barrier.

This isolation comes at a cost. The STGAP2SICSC’s larger 8-pin SOIC package consumes more PCB area and requires careful layout to maintain creepage and clearance distances per IEC 60664-1 standards. Designers must place SMT ceramic capacitors close to supply rails and avoid conductive areas beneath the IC to prevent coupling issues. The MCP1402T-E/OT’s small SOT-23-5 package fits well in compact designs without such layout constraints.

Peak output current capability is another major consideration. The ST device supports up to 4A peak source and sink current, enabling fast charging/discharging of large gate capacitances for high-speed switching and low switching losses in high-power applications. The MCP1402T-E/OT maxes out at 500mA, which limits switching speed and may increase losses in large MOSFETs or IGBTs. However, for smaller MOSFETs or lower switching frequencies, the MCP1402T-E/OT’s current is sufficient and more power-efficient.

Thermally, the MCP1402T-E/OT can operate up to 150°C junction temperature, providing more headroom in harsh environments. The ST device is limited to 125°C max junction temp and has a relatively high thermal resistance (120°C/W), requiring thermal mitigation especially at high switching currents.

The MCP1402T-E/OT supports a wider supply voltage range (4.5V to 18V) suitable for a variety of gate voltage standards, whereas the STGAP2SICSC logic supply is limited to 3.1V to 5.5V, with the gate drive supply operating typically at 26V. This split supply requirement and UVLO thresholds (around 14.6V) in the ST device complicate power sequencing and supply design but enable operating at higher gate voltages safely.

From a firmware perspective, the STGAP2SICSC has longer propagation delays (~75ns typical) and slower rise/fall times (30ns typical) compared to the MCP1402T-E/OT (15–19ns). This can impact timing-critical applications where tight synchronization or very high switching frequency (>1MHz) is desired. The ST device is rated for 1MHz max switching frequency, while the MCP1402T-E/OT datasheet does not specify a max frequency but its faster switching times imply suitability for similar or higher frequencies in non-isolated applications.

Cost-wise, the MCP1402T-E/OT is likely cheaper and simpler to implement due to its smaller package and lack of isolation. The STGAP2SICSC’s isolation and integrated clamp, plus more complex package and layout requirements, add BOM and manufacturing cost.


Use-case fit

Choose MCP1402T-E/OT when…