LM2596 Adjustable Buck Converter Shootout: T-ADJ vs. S-ADJ

The LM2596T-ADJ/NOPB wins for applications prioritizing compact size and lower BOM cost, leveraging its TO-220 package and generally more forgiving layout requirements. However, the LM2596S-ADJ’s SO-8 package shines when space is at an absolute premium and a slightly more sophisticated PCB layout can be tolerated for marginally improved thermal performance.

Spec Comparison Table

SpecLM2596T-ADJ/NOPBLM2596S-ADJNotes
PackageTO-220SO-8T-ADJ wins for lower cost and easier heat sinking; S-ADJ wins for smallest footprint.
Input Voltage Range3.0–40V3.0–40VIdentical.
Output Voltage Range1.23–37V (adjustable)1.23–37V (adjustable)Identical.
Output Current3A3AIdentical.
Switching FrequencyNot specifiedNot specifiedBoth unspecified, typical values are around 150 kHz.
Duty Cycle0%–100%0%–100%Identical.
Switch Saturation Voltage (typ)1.16V1.16VIdentical.
Output Voltage Line Regulation (typ)Not specifiedNot specifiedBoth unspecified.
Quiescent Current (typ)Not specifiedNot specifiedBoth unspecified.
Input Current (no load)Not specifiedNot specifiedBoth unspecified.
Output Voltage Feedback Pin Voltage (typ)1.23V1.23VIdentical.
Output Voltage Feedback Pin Input Current (typ)5 µA5 µAIdentical.
Junction to Ambient Thermal Resistance (typical)Not specifiedNot specifiedBoth unspecified.
Junction to Ambient Thermal Resistance (min)Note 11: Junction to ambient thermal resistance (no external heatsink) for the TO-220 package mounted vertically, with the leads soldered to a printed circuit board with (1oz.) copper area of approximately 1 in^2.Note 12: Junction to ambient thermal resistance with the TO-263 package tabs soldered to a single printed circuit board with 0.5 in^2 of (1oz.) copper area.T-ADJ easier to cool with minimal effort; S-ADJ requires more careful layout.
Inductor (µH)Not specifiedNot specifiedBoth unspecified, typical values are around 33 µH.
Output CapacitorNot specifiedNot specifiedBoth unspecified.

Design Trade-offs

The most significant difference is the package. The TO-220 of the T-ADJ allows for simpler heat sinking. A small finned heatsink can be added with minimal effort, which is critical for applications running near the 3A current limit. The SO-8 package of the S-ADJ presents a thermal challenge. While the junction-to-ambient resistance is theoretically lower, achieving that requires careful PCB layout with sufficient copper area for heat spreading. Without it, the die temperature can quickly rise, forcing a reduction in current limit or requiring a forced-air cooling solution.

The lack of specified switching frequency makes accurate efficiency curve modeling difficult. However, the 1.16V saturation voltage implies a fixed gate drive voltage, which limits efficiency at higher currents. The T-ADJ’s larger package allows for a more robust gate driver implementation, which might offer slightly better transient response, but this is largely dependent on external component selection.

The lack of detailed specification data means a detailed cost comparison is impossible. However, the TO-220 package generally translates to lower BOM cost due to higher volume availability and simpler manufacturing processes. The SO-8 package’s smaller size can reduce PCB area, which might offset some of the cost savings.

Layout sensitivity is another key consideration. The T-ADJ’s larger footprint allows for more relaxed component placement and trace routing. The S-ADJ demands tighter tolerances and careful attention to parasitic inductance and capacitance.

Use-case Fit

Choose LM2596T-ADJ/NOPB when…

Choose LM2596S-ADJ when…

Drop-in Compatibility

The LM2596T-ADJ/NOPB and LM2596S-ADJ are not pin-compatible. The T-ADJ uses a TO-220 package with three leads (GND, Vin, Vout), while the S-ADJ uses an SO-8 package with eight leads (GND, Vin, Feedback, Adjust, Switch Driver, Bootstrap, Output, Enable). Footprint compatibility is also nonexistent. Substituting one for the other requires a complete PCB redesign.

Alternatives to Consider