Key Specs

SpecValueConditionSource
Control FeaturesSoft StartDigi-Key
Duty Cycle75%Digi-Key
Fault ProtectionCurrent Limiting, Open Loop, Over Load, Over Temperature, Over VoltageDigi-Key
Internal Switch SYesDigi-Key
Mounting TypeSurface MountDigi-Key
Operating Temperature Range-40°C ~ 150°C (TJ)Digi-Key
Output IsolationIsolatedDigi-Key
Package Case16-SOIC (0.154”, 3.90mm Width), 12 LeadsDigi-Key
Power Watts25 WDigi-Key
Supplier Device PackagePG-DSO-12-10Digi-Key
Supply Voltage (Typ)10.3V ~ 26VDigi-Key
Switching Frequency (Typ)67kHzDigi-Key
TopologyFlybackDigi-Key
Voltage Breakdown650VDigi-Key
Voltage Start Up18 VDigi-Key

When To Use

Use the ICE3B0565JGXUMA1 in isolated flyback power supply applications requiring up to 25 W output power with a supply voltage range of 10.3 V to 26 V. Its integrated internal switch and 650 V breakdown voltage make it suitable for compact, surface-mount designs operating at a typical switching frequency of 67 kHz. Avoid using this device in applications requiring output power beyond 25 W or where the operating temperature exceeds -40°C to 150°C (TJ); in such cases, consider higher power or extended temperature range controllers.

When Not To Use

  1. Non-isolated 12V to 3.3V @ 5A point-of-load: The 25W power limit and isolated flyback topology disqualify this part for high-current non-isolated step-down. Use a high-current synchronous buck with external FETs for current capability and efficiency.

  2. Battery-powered sensor needing μA standby current: The internal switch and typical control bias mean quiescent current is not optimized for ultra-low power. A low-IQ PFM buck is better suited for minimal battery drain in sleep modes.

  3. High-frequency LED driver at 300kHz switching: The fixed 67kHz switching frequency limits transient response and inductor size reduction. For switching above 500kHz, choose a high-frequency buck controller.


Application Notes

The internal power switch connected to the drain pin is the primary switching node and must have the smallest possible loop area to minimize EMI and switching losses. The control input pins are noise-sensitive and should be routed away from high-current switching loops. Although the device integrates the switch, at full load near 25 W and maximum operating temperature of 150°C (TJ), adequate PCB copper area or a thermal pad should be provided to ensure proper heat dissipation without an external heatsink.

Gotchas

  1. Connecting the device in a non-isolated topology: If the designer uses the ICE3B0565JGXUMA1 in a non-isolated power supply design, the device may experience overstress due to the lack of proper isolation, leading to device failure. Always ensure the application uses an isolated flyback topology as specified.

  2. Exceeding the maximum duty cycle of 75%: Attempting to operate the device beyond its 75% maximum duty cycle can cause excessive stress on the internal switch and increase thermal dissipation, potentially causing premature device failure. To avoid this, design the control loop and transformer parameters to maintain the duty cycle within the specified limit.