ICE1PCS02G vs L4984DTR: PFC Controller IC Comparison

Quick verdict

For legacy or through-hole designs prioritizing simplicity and ease of prototyping, the ICE1PCS02G is the better choice due to its DIP-8 package and well-defined 65kHz switching frequency. For compact, thermally demanding, or modern surface-mount designs requiring a wider operating temperature range and lower startup current, the L4984DTR offers an edge despite the lack of a fixed switching frequency specification.

Spec comparison table

SpecICE1PCS02GL4984DTRNotes
Current startup100 µA65 µAL4984DTR has lower startup current, beneficial for lower power loss during startup.
ModeContinuous Conduction (CCM)Continuous Conduction (CCM)Both support CCM, so no differentiation here.
Mounting typeThrough HoleSurface MountICE1PCS02G suits prototyping and hand assembly; L4984DTR is better for automated SMT lines.
Operating temperature-40°C to 125°C-40°C to 150°CL4984DTR supports 25°C wider max temp range, better for high-temperature environments.
Package case8-DIP (0.300”, 7.62 mm)10-SOP (0.154”, 3.90 mm width)L4984DTR is smaller footprint, enabling more compact PCB layouts.
Supplier device packagePG-DIP-8-1210-SSOPDifferent package types, impacting assembly and thermal dissipation.
Switching frequency typ65kHzNot specifiedFixed 65kHz simplifies design predictability on ICE1PCS02G; L4984DTR frequency must be set externally or varies.
Voltage supply10.2V to 21V10.3V to 22.5VL4984DTR has slightly wider supply range, accommodating a broader input voltage window.

Design trade-offs

The ICE1PCS02G’s fixed switching frequency of 65kHz simplifies EMI filtering and transformer design, which can reduce development time in classic PFC stages. However, it may limit flexibility in optimizing efficiency or noise for specific applications. The L4984DTR does not specify a fixed switching frequency, implying the frequency is set externally or varies with operating conditions. This adds design freedom but requires more careful frequency planning and potentially complicates EMI compliance.

Thermally, the L4984DTR’s wider operating temperature range to 150°C gives it a stronger margin in harsh environments or compact designs where cooling is constrained. The surface-mount 10-SSOP package also supports better thermal conduction via PCB copper compared to the through-hole DIP-8 of the ICE1PCS02G, which dissipates heat less efficiently and is bulkier.

Startup current is a critical spec in low standby power designs. The L4984DTR’s 65µA startup current is 35% lower than the ICE1PCS02G’s 100µA, reducing losses during no-load or light-load conditions and contributing to better compliance with energy efficiency regulations.

From a layout perspective, the ICE1PCS02G’s through-hole DIP is simpler for hand soldering and prototyping but less suitable for automated assembly and miniaturized boards. The L4984DTR’s smaller SSOP package reduces PCB area and can improve high-frequency layout performance due to shorter traces and lower parasitic inductance.

Cost at volume depends heavily on packaging and sourcing. Through-hole parts like the ICE1PCS02G typically cost more in large automated SMT assemblies due to handling complexity and board space. Conversely, the L4984DTR’s surface-mount format is preferred in high-volume consumer or industrial products, potentially lowering overall BOM cost despite similar silicon die costs.

Use-case fit

Choose ICE1PCS02G when…

Choose L4984DTR when…

Drop-in compatibility

These parts are not pin-compatible and have different package types (DIP-8 for ICE1PCS02G vs 10-SSOP for L4984DTR). Substituting one for the other will require PCB redesign, as well as verification of frequency setting and thermal considerations. There is no indication from the data provided that they share pinouts or can be interchanged without hardware changes.

Alternatives to consider