MCP1402T-E/OT vs 1ED2147S65FXUMA1: Gate Driver ICs Comparison

Quick verdict

For low-voltage, low-side MOSFET or IGBT gate driving where board space is limited and moderate peak current (up to 500 mA) suffices, the MCP1402T-E/OT is the practical choice due to its small SOT-23-5 package and simple drive requirements. For high-voltage, high-side SiC MOSFET applications requiring robust isolation, higher peak drive current (4 A), and integrated fault detection features, the 1ED2147S65FXUMA1 is the clear winner despite its larger footprint and higher system complexity.


Spec comparison table

SpecMCP1402T-E/OT1ED2147S65FXUMA1Notes
Channel typeSingleSingleBoth single-channel drivers; no advantage.
Current peak output source/sink500 mA / 500 mA4 A / 4 A1ED2147S65FXUMA1 can drive larger gate charge devices faster, critical for SiC MOSFETs.
Driven configurationLow-SideHigh-SideMCP1402T limited to low-side; 1ED2147S65FXUMA1 supports high-side driving.
Gate typeIGBT, MOSFET (N-Channel, P-Channel)SiC MOSFET1ED2147S65FXUMA1 specialized for SiC MOSFETs, MCP1402T more generic.
Input typeNon-InvertingNon-InvertingBoth non-inverting inputs; no difference.
Logic voltage V_IL / V_IH0.8 V / 2.4 V0.8 V / 2.4 VIdentical input thresholds; compatible logic interface.
Supply voltage4.5 V ~ 18 V7.2 V ~ 22 VMCP1402T supports lower voltage operation; 1ED2147S65FXUMA1 requires higher voltage.
Operating temperature range-40°C ~ 150°C (TJ)-40°C ~ 125°C (TJ)MCP1402T has wider temp range; better for high-temp environments.
Package case / Supplier device packageSC-74A, SOT-753, SOT-23-5PG-DSO-8MCP1402T smaller, better for space-constrained designs; 1ED2147S65FXUMA1 larger package.
Rise / fall time (typ)19 ns / 15 ns12 ns / 12 ns1ED2147S65FXUMA1 is faster; beneficial for high-frequency switching.
Blocking voltage offsetN/A+650 V OFFSETOnly 1ED2147S65FXUMA1 supports high voltage isolation for high-side applications.
Bootstrap diode resistanceN/ALow R Bootstrap Diode R F1ED2147S65FXUMA1 optimized bootstrap diode reduces losses in bootstrap operation.
Charge device model (CDM) voltageNot specified1.0 kV1ED2147S65FXUMA1 has better ESD robustness.
Human body model (HBM) voltageNot specified2.0 kV1ED2147S65FXUMA1 more robust to HBM ESD.
Propagation delay (typ)Not specified+55 ns / -55 ns (typ)1ED2147S65FXUMA1 provides detailed timing; typical ~80 ns on turn-on/off delays.
Output current typicalNot specified+4 A / -4 A (typ)Matches peak current rating; 1ED2147S65FXUMA1 suitable for high gate charge devices.
Package dimensions (typical)SOT-23-5 (approx. 2.9 mm × 1.3 mm)PG-DSO-8 (8.1 mm × 4.1 mm × 1.6 mm)MCP1402T is significantly smaller; 1ED2147S65FXUMA1 requires more PCB area.
Mounting typeSurface MountSurface MountBoth surface mount; standard SMT assembly.
Number of drivers11Single driver each.
UVLO thresholdsNot specified7.2 V / 6.8 V (typ MOSFET), 10.0V / 8.7V (typ IGBT)1ED2147S65FXUMA1 integrates UVLO for device protection.
Supply voltage max18 V25 V1ED2147S65FXUMA1 supports higher supply voltage margin.
CS blanking time (max/typ/min)N/A350 ns / 260 ns / 170 ns1ED2147S65FXUMA1 includes current sense blanking for fault detection.
CS shutdown propagation delayN/A410 ns / 330 ns / 250 nsFault shutdown responsiveness in 1ED2147S65FXUMA1.
Fault clear time (typ)N/A~10 µs1ED2147S65FXUMA1 has fault management features.
UVLO glitch filter time (min)N/A1 µsHelps reduce false triggering in 1ED2147S65FXUMA1.
Negative transient immunityN/A100 V1ED2147S65FXUMA1 designed to survive high dv/dt conditions typical in SiC applications.
Roadson (typ)Not specified~50 ΩInternal resistance relevant for drive current limits in 1ED2147S65FXUMA1.

Design trade-offs

The MCP1402T-E/OT is a compact, simple low-side driver optimized for low-to-medium power MOSFET or IGBT applications. Its peak output current of 500 mA is sufficient for devices with modest gate charge, and the small SOT-23-5 package enables tight board layouts and reduced parasitic inductances. The relatively fast rise/fall times (~15–19 ns) allow switching frequencies up to several hundred kHz, depending on the gate charge and layout. The supply voltage range down to 4.5 V also facilitates operation in low-voltage environments.

In contrast, the 1ED2147S65FXUMA1 targets high-voltage, high-side SiC MOSFET gate driving, supporting supply voltages up to 25 V and capable of sourcing and sinking up to 4 A peak current. This capability is essential for driving SiC devices with large gate charge at high switching speeds, where rapid transitions reduce switching losses but increase layout sensitivity. The integrated bootstrap diode with low resistance and built-in fault detection (current sense, desaturation) add protection but also increase design complexity. Its propagation delays (typical ~80 ns) and rise/fall times (~12 ns) are optimized for fast switching while managing electromagnetic interference.

Thermally, the MCP1402T’s smaller package limits heat dissipation, making it best suited for applications with lower continuous gate drive currents or where external heatsinking is possible. The 1ED2147S65FXUMA1’s larger PG-DSO-8 package offers better thermal dissipation but requires more board area and careful layout, especially for high dv/dt isolation and to minimize stray inductance in the high-side floating supply.

From a firmware perspective, the MCP1402T is a straightforward non-inverting driver with no fault feedback signals, simplifying control but requiring external protection circuits. The 1ED2147S65FXUMA1 includes fault reporting and current sense blanking features, useful for advanced diagnostics but requiring additional firmware integration and careful timing considerations.

Cost-wise, the MCP1402T is generally cheaper and more readily available in compact formats. The 1ED2147S65FXUMA1, with its specialized features and package, comes at a premium but delivers capabilities necessary for high-voltage SiC applications.


Use-case fit

Choose MCP1402T-E/OT when…

Choose 1ED2147S65FXUMA1 when…